- 产品详情
Introduction and features:
The equipment is to laminate the sheet-type cover film, EMI, pure glue, and outer copper foil to the inner FPCB or multi-layer FPCB through the PIN alignment method. It can be attached to 1-5 pieces at a time according to the product type. ; Can be single-sided or double-sided, multi-layer lamination; the thickness of the product can be selected according to the height of the cylinder. The equipment is portable, safe, fast and easy to produce.
Features:
• The high temperature function of the equipment can reach 180 degrees.
• Suitable for covering film, EMI, pure glue, outer copper foil.
• Aluminum type multi-hole fixture with high flatness.
• The pressure is designed according to the 550mm*650mm table top.
• Uniform temperature: 4 blocks up and down for management.
• Adopt travel and exit design, safe and stable.
• Touch screen control, parameter setting and memory function.
• Safety light curtain and high temperature protection.
• Use temperature-resistant material components and pipeline configuration.
• It can be used for multi-layer board bonding and pure glue bonding.
• Chinese interface, easy to operate.
Basic specifications of the machine:
electricity demand | AC220V, 50HZ, 6KW |
Maximum machine size | 1100mm(L) ×900mm(W) × 1800mm(H) |
Working height | 700mm-800mm |
Pneumatic pressure | 5-7kg/cm² |
Machine weight | 300 ㎏ (MAX); |
Applicable product specifications | 550mm*650mm |
* Equipment design and specifications can be adjusted to improve equipment performance.