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Multilayer board laminating machine FLB-CCL-250/500DR

Introduction and features:

This equipment is developed for the bonding of multi-layer boards. In order to improve efficiency, yield and accuracy, a fully automatic bonding method is adopted. ; This equipment includes: automatic board placement, cleaning, laminating, fast pressing, CCD cutting machine, board collection, spacer paper and other processes, greatly reducing labor and land occupation, water and electricity. Mainly used in: three-layer boards, four-layer boards, five-layer boards and more.

 

Advantage:

• Fully automatic lamination.

• Cleaning function.

• Improve yield.

• Improve accuracy.

• Connect to MES system.

• Can realize scanning retrospective.

• It can realize AGV docking.

• CP can be calculated automatically

 

Basic specifications of the machine:

electricity demand

AC220V/3P 60HZ / 20KW

Maximum machine size

6000mm(L) ×2900mm(W) × 2300mm(H)

Working height

950mm-1100mm

Pneumatic pressure

6kg/cm², consumption 2000/min;

Machine weight

10000 ㎏ (MAX);

Applicable product specifications

260mm *500 mm or 520mm*630mm

* Equipment design and specifications can be adjusted to improve equipment performance.


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